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システムインテグレーションに関する国際会議 IEEE/SICE
SII 2021についてご案内申し上げます．
https://sice-si.org/conf/SII2021/index.html
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Call for Papers
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SII2021
2021 IEEE/SICE International Symposium on System Integration
January 11-14, 2021. Iwaki, Japan
https://sice-si.org/conf/SII2021/index.html
IEEE/SICE SII is the premier symposium series presenting the state of the art and future perspectives of system integration, where industry experts, researchers, and academics share ideas and experiences surrounding frontier technologies, breakthrough and innovative solutions and applications.
The 2021 IEEE/SICE International Symposium on System Integration (SII 2021) will be as the 13th symposium on system integration. System integration is one of the key technologies and the integration of hardware and software is especially important to solve the industrial or social system problems in new century. This symposium focuses to the new research and industrial application of system integration, and discusses the approach method to improve effectiveness of system integration.
*SII 2021 will be held as scheduled. There will be no postponement or cancellation of the symposium.
All accepted and registered papers will be published in the symposium proceedings to be included in IEEE Xplorer.
SII 2021 organizers continue to monitor the situation and how to hold the symposium is currently under consideration.
Further information will be posted on this website when available.
Submission deadline:
Special Session (SS), Tutorial and workshop proposals: August 1, 2020
Full paper submission deadline: August 1, 2020
Notification of acceptance: September 20, 2020
Final paper submission deadline: October 10, 2020
Short paper submission deadline: September 30, 2020
Notification of acceptance: October 10, 2020
CONTACT: contact-sii2021@sice-si.org
SPONSORS
Co-Sponsors
SICE System Integration Division
IEEE Robotics and Automation Society
IEEE Industrial Electronics Society
SII2021 Organizing Committee
General Chair:
Kuniaki KAWABATA (Japan Atomic Energy Agency, Japan)
Program Chair:
Mihoko NIITSUMA (Chuo University, Japan)
Program Co-Chairs:
Yutaka HIROI (Osaka Institute of Technology, Japan)
Wei Deng Solvang (The Arctic University of Norway, Norway)
Financial Chair:
Sho YOKOTA (Toyo University, Japan)
Award Chair:
Hideki HASHIMOTO (Chuo University, Japan)
Special Sessions Chairs:
Satoru TAKAHASHI (Kagawa University, Japan)
Takayuki TANAKA (Hokkaido University, Japan)
Interactive Session Chair:
Takeshi SASAKI (Shibaura Institute of Technology, Japan)
Publication Chair:
Daisuke CHUGO (Kwansei Gakuin University, Japan)
Events Chair:
Mitsuru ENDO (Tokyo Institute of Technology, Japan)
Publicity Chairs:
Keita NAKAMURA (The University of Aizu, Japan)
Gabor Sziebig (SINTEF Manufacturing AS, Norway)
Local Arrangement Chair:
Toshihide HANARI (Japan Atomic Energy Agency, Japan)
Conference Secretary:
Taichi YAMADA (Japan Atomic Energy Agency, Japan)
配信元・問合先――――――――――――――――――――――――――――
廣井 富
大阪工業大学 ロボティクス＆デザイン工学部 ロボット工学科
yutaka.hiroi@oitac.jp